Plasma FIB
What Is Plasma FIB?
Plasma FIB uses a focused beam of ions generated from a plasma source (commonly xenon ions) to mill, section, or modify materials at the micro- to nanoscale. The high beam current enables fast and efficient material removal, while maintaining precise control over the region of interest.
Plasma FIB is often integrated with SEM imaging, allowing real-time observation of internal structures during milling.
What Plasma FIB Can Do
Plasma FIB enables:
Rapid cross-sectioning of thick or hard materials
Large-area trenching and volume milling
Site-specific sample preparation
Exposure of buried features and interfaces
3D microstructural investigation
Preparation of samples for SEM, TEM, or other analyses
It bridges the gap between conventional mechanical sectioning and high-resolution ion beam techniques.
Why Use Plasma FIB?
Plasma FIB is chosen when conventional FIB or mechanical methods are too slow or insufficient. It helps answer questions such as:
What is the internal structure of a thick or multilayer material?
Where did failure initiate beneath the surface?
How do interfaces or defects extend through the bulk?
Can a specific region be isolated for further analysis?
How can large features be exposed without damaging critical areas?
Plasma FIB significantly reduces preparation time for complex investigations.
Typical Application Scenarios
Failure Analysis
Cross-sectioning of cracks, voids, or delamination regions
Investigation of buried defects or inclusions
Correlation of surface damage with subsurface features
Materials Characterization
Microstructural analysis of metals, alloys, and ceramics
Investigation of coatings and multilayer systems
Interface and phase boundary exposure
Electronics & Semiconductor Analysis
Delayering and cross-sectioning of packaged devices
Exposure of interconnects, vias, and buried structures
Preparation for detailed SEM or TEM analysis
Advanced Sample Preparation
Large-volume material removal prior to fine FIB work
Site-specific lift-out preparation for TEM
Preparation of samples for complementary techniques
Sample Types
Plasma FIB can be applied to:
metals and alloys
ceramics and hard materials
semiconductors and electronic components
coatings, composites, and multilayer systems
Xinbodi evaluates sample size, hardness, and analytical goals to select optimal milling conditions.
What You Will Receive
Each Plasma FIB project is delivered with a clear, structured outcome suitable for technical decision-making. A typical deliverable includes:
project objective and region-of-interest definition
Plasma FIB milling and imaging conditions
cross-sectional SEM images or videos
documentation of internal structures and defects
correlation with failure or processing history
recommendations for follow-up analysis (e.g., TEM, EDS, EBSD)
Why Choose Xinbodi for Plasma FIB?
High-speed, large-volume milling capability
Experience with complex and hard-to-section materials
Precise site-specific targeting
Integration with SEM imaging and analytical workflows
Strong expertise in failure analysis and microstructural interpretation
Strict confidentiality for proprietary samples and data
FAQs
How is Plasma FIB different from conventional FIB?
Plasma FIB offers much higher milling rates, making it suitable for large or thick samples, while conventional Ga⁺ FIB is better for fine, small-scale milling.
Is Plasma FIB destructive?
Yes. Plasma FIB removes material from the sample, but it does so in a controlled and targeted manner.
Can Plasma FIB be combined with other techniques?
Yes. Plasma FIB is often used as a preparation step before SEM, TEM, EDS, or other microanalytical techniques.
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