Semiconductors
Semiconductor manufacturing depends on ultra-clean materials and tightly controlled processes. Small amounts of contamination—especially at surfaces and interfaces—can drive major impacts on yield, reliability, and electrical performance. Semiconductor materials and chemistries are used throughout wafer fabrication, packaging/assembly, and high-purity supply chains, where control of trace metals, ionic species, organic residues, thin film integrity, and surface chemistry is critical.
We provide analytical testing and materials characterization for semiconductor-related materials and components, supporting process development, incoming QC, supplier qualification, contamination troubleshooting, and failure/root-cause investigations. Our multi-technique approach delivers clear, decision-ready results—especially for “what changed?” comparisons and contamination source identification.
Why Testing Matters in Semiconductors
Semiconductor yield and reliability depend on controlling:
Ultra-trace metals (often linked to leakage, defects, or yield loss)
Ionic contamination (Na/K/Cl and similar species driving corrosion or electrical drift)
Organic residues and films (photoresist-related residues, silicones, surfactants, cleaners)
Thin film properties (composition, chemical states, thickness/roughness—project-dependent)
Surface chemistry and treatment effects (cleaning efficacy, plasma treatment outcomes)
Defect particles and residues (source identification and process corrective actions)
Our lab combines surface-sensitive tools with elemental and molecular analysis to deliver an evidence-based explanation of what changed and where it came from.
FAQs
Can you detect ultra-low contamination levels?
Often yes, depending on matrix and target species. We will recommend the best method (ICP-MS, TXRF, IC, TOF-SIMS/XPS) based on required limits and sample type.
Do you need a reference sample?
Strongly recommended. A known-good lot enables faster and more defensible conclusions.
How do you choose between XPS and TOF-SIMS?
XPS is strong for chemical states and quantitative surface composition; TOF-SIMS is extremely sensitive to trace organics/ions and high-resolution chemical imaging. They are complementary.
Can you identify particles/defects?
Yes. SEM-EDS + Raman/FTIR is a common workflow for rapid defect identification.
Is analysis destructive?
Most surface analyses are minimally destructive, but depth profiling and some particle prep can be destructive in the analyzed area. We’ll clarify in the method plan.