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RTX

What Is RTX (Real-Time X-ray)?

RTX (Real-Time X-ray) is a non-destructive X-ray inspection method that produces live radiographic images of a sample’s internal structure. In materials and electronics work, RTX typically uses a microfocus X-ray source and detector to visualize internal features such as voids, cracks, misalignment, solder integrity, and density variations—often without opening or sectioning the part.

Key advantages

  • Non-destructive internal inspection for many parts and assemblies

  • Fast localization of hidden issues before destructive cross-sectioning

  • Excellent for electronics, solder joints, and metallurgical samples (project-dependent)

What RTX Is Used For

RTX is commonly used to detect and evaluate:

  • Voids and porosity (e.g., in solder joints, brazes, castings—project-dependent)

  • Cracks and internal damage (handling, impact, fatigue initiation—project-dependent)

  • Solder joint quality (BGA/under-package regions, bridges/opens indicators—project-dependent)

  • Assembly misalignment (component placement, internal shift, foreign objects—project-dependent)

  • Inclusions or density variations in metallurgical samples (project-dependent)

  • Process comparisons (before/after rework, supplier changes, new process windows)

Why RTX (vs. Cross-Sectioning or Standard X-ray)?

  • Compared with destructive cross-sections: RTX helps you find the defect first, so any follow-on sectioning (mechanical or FIB) can be targeted to the true ROI.

  • Compared with static radiography: RTX emphasizes live inspection—useful for quick exploration, multiple viewing angles, and iterative troubleshooting.

Sample Types We Support

RTX can be applied to many sample forms (project-dependent), including:

  • Electronics & packaging: PCBs, components, solder joints, connectors

  • Metals & assemblies: welds/brazes, small cast parts, machined assemblies (project-dependent)

  • Composite/adhesive assemblies (project-dependent): internal voids, trapped air, bond quality indicators

  • Small mechanical parts: fastener assemblies, housings, microfeatures (project-dependent)

Best practice: include a reference/control (known-good) sample when the goal is “what changed?”

Typical Workflows

Quick Internal Screening (Go/No-Go)

Best for: incoming inspection, fast triage

  • Scan from multiple angles

  • Flag suspect regions and document key frames

  • Provide a concise defect summary

Failure Localization (Find the ROI)

Best for: intermittent failure, suspected void/crack site

  • Systematic inspection to identify the most likely defect location

  • Mark ROI for targeted cross-section or additional testing

Process / Rework Comparison

Best for: verifying process changes or repairs

  • Before/after RTX imaging under consistent settings

  • Clear comparison of voiding, alignment, or internal geometry shifts

What You Receive

  • RTX images (and short video clips if needed, scope-dependent)

  • Annotated findings: defect type, location, relative severity, and key dimensions where measurable (project-dependent)

  • Recommendation for next steps when confirmation is required (cross-section, SEM/EDS, CT, etc.)

Sample Submission Guidelines

Please provide

  • Sample description and the question (voids? cracks? solder quality? alignment?)

  • ROI marking and orientation notes (photos help a lot)

  • Any process history (reflow/rework, thermal cycling, mechanical shock, supplier/lot change)

  • Reference/control sample whenever possible

Packaging tips

  • Protect from shock/bending during shipping (new cracks can form in transit)

  • Keep orientation labeled (top/bottom, connector side, etc.)

  • For ESD-sensitive electronics, use appropriate ESD packaging

FAQs

Not exactly. RTX is typically 2D real-time radiography. CT reconstructs a 3D volume from many projections. RTX is often faster for screening; CT is used when you need full 3D defect geometry (project-dependent).

Often it can provide practical voiding indicators and measurements depending on geometry and method requirements, but exact quantitation rules depend on your standard/spec and the specific joint type (project-dependent).

RTX is generally non-destructive. The sample is exposed to X-rays, but the part remains intact (project-dependent).

When you need definitive confirmation of the mechanism, microstructure, or chemistry (e.g., IMC issues, corrosion, contamination). RTX is excellent for locating where to section.

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