Atom Probe
What Is Dual Beam (FIB-SEM)?
Dual Beam typically refers to a FIB-SEM system that combines a Focused Ion Beam (FIB) column with a Scanning Electron Microscope (SEM) in one tool. The SEM provides high-resolution imaging of surface and cross-sectional features, while the FIB can mill, cut, polish, and modify a precise region of the sample—enabling site-specific cross-sections, subsurface defect localization, and TEM lamella preparation.
Key advantages
Site-specific cross-sectioning exactly where the defect/feature is
High-resolution SEM imaging of microstructure, layers, and interfaces
Enables TEM sample preparation (lamella lift-out) for nanoscale analysis (project-dependent)
Supports 3D reconstruction via serial sectioning (project-dependent)
What Dual Beam Is Used For
Dual Beam (FIB-SEM) is widely used for:
Cross-section analysis of multilayers, coatings, thin films, and interfaces
Defect localization (voids, delamination, cracks, inclusions, pores) beneath the surface
Semiconductor / electronics FA (opens/shorts support, via/line issues, delamination—project-dependent)
Failure analysis of metals, ceramics, composites, and polymers (project-dependent)
Microstructure examination (grain structure, porosity networks, particle dispersion)
Site-specific TEM lamella prep for follow-on TEM/STEM/EDS/EELS studies (project-dependent)
3D tomography / serial sectioning to visualize internal structures (project-dependent)
Why Dual Beam (vs. Mechanical Cross-Sectioning)?
Traditional mechanical sectioning can be fast, but it may miss the exact feature of interest or introduce deformation. Dual Beam offers:
Precision targeting: mill exactly where needed (micron-scale localization)
Cleaner, flatter cross-sections for challenging materials (project-dependent)
Access to buried features without full sample destruction
Direct pathway to TEM through lamella lift-out when nanoscale detail is required
Sample Types We Support
Dual Beam can be applied to many sample types (project-dependent), including:
Semiconductors & electronics: wafers/coupons, packages, solder joints, connectors
Coatings & thin films: barrier layers, functional coatings, plated layers
Metals & alloys: fractures, corrosion sites, weld/HAZ features
Ceramics & composites: pores, interfaces, fiber/matrix regions
Polymers & adhesives (project-dependent): delamination interfaces, inclusions, contamination sites
Particles & inclusions: embedded foreign matter requiring targeted cross-sectioning
Best practice: submit a reference/control sample (non-failed or known-good) alongside the failed sample for faster comparison.
Typical Workflows
Site-Specific Cross-Section + SEM Imaging
Best for: delamination, voids, cracks, layer thickness questions
Targeting of ROI (region of interest)
FIB milling/polishing of cross-section
SEM imaging of structure, interfaces, and defect morphology
Optional: elemental checks if paired with EDS capability (project-dependent)
Defect Localization for Failure Analysis
Best for: “where is the failure initiating?”
Navigate to suspect region (fracture origin, corrosion pit, short site)
Cross-section and imaging to confirm root feature
Compare to reference sample for “what changed?”
TEM Lamella Preparation (Lift-Out)
Best for: nanoscale interface questions or thin film stacks
Site-specific lamella extraction from ROI
Thinning to electron transparency
Transfer for TEM/STEM analysis (project-dependent)
3D Serial Sectioning (Tomography)
Best for: pore networks, particle distributions, complex internal geometry
Repeated FIB slice + SEM image acquisition
3D reconstruction and feature quantification (project-dependent)
What You Receive
SEM images of surfaces and/or cross-sections with scale bars and annotations
A short interpretation summary: defect type, location, morphology, and likely origin pathways (project-dependent)
If included: measurements (layer thickness, void size, crack length, feature dimensions)
If TEM prep is included: documentation of ROI selection and lamella status/transfer notes
Sample Submission Guidelines
Please provide
Sample description and target question (cross-section, defect, layers, FA, TEM prep)
Where the problem is observed (photos, coordinates, marking, microscope images if available)
Material stack info (layers, coatings, plating, known thickness ranges—if available)
Handling restrictions (ESD, cleanroom packaging, hazardous materials)
Packaging tips
Protect critical surfaces from touching/rubbing (use clean holders, gel-paks, or foam)
Clearly label ROI and orientation (top/bottom, front/back, flow direction)
For tiny parts, secure in a small container to prevent movement
FAQs
Is Dual Beam analysis destructive?
Yes—FIB milling removes material in the targeted region. The rest of the sample is typically preserved.
Can you measure layer thickness accurately?
Often yes, especially on a well-prepared cross-section. Measurement uncertainty depends on contrast, edge definition, and sample geometry (project-dependent).
Do you need to coat the sample?
Some non-conductive samples may require conductive coating or charge mitigation strategies (project-dependent). We’ll choose the least disruptive option.
Can Dual Beam replace TEM?
Dual Beam provides excellent cross-sections and SEM imaging, but TEM offers higher-resolution internal structure and chemistry. Dual Beam is often the bridge to prepare TEM lamellae.
What if I don’t know where the defect is?
Share as much context as possible (photos, failure location, electrical test maps, etc.). We can propose a localization strategy, but site specificity works best when the ROI is known.
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- yangxbd@gmail.com